开云手机在线登陆入口,开云(中国)
PRODUCT TECHNOLOGY
技术路线
产品服务
Turnkey Solution
Package Design
Package Design
(Strategic Partnership)
TJS have a strategic partnering relationship with Jiangsu Nepes. We leverages each respective expertise to jointly develop and market technologies for Flipchip turnkey solution.
  • 8“ Gold Bump(including COG/COF)
  • 8“ Solder Bump/WLCSP, Copper Pillar Bump、RDL
  • 12"CopperPillar Bump
  • CP/F & Backend Full Turnkey Service
yuan.douglas@taijisemi.com
0512-62622592